ArF Photoresist Material no Photolithography

Semixlab Photoresist Material

ʻO ka Photoresist e pili ana i kahi mea kiʻiʻoniʻoni lahilahi etching-resistant nona ka solubility e hoʻololi ma lalo o ka irradiation a i ʻole radiation o ke kukui ultraviolet, electron beam, ion beam, X-ray, a me nā mea ʻē aʻe. ʻOi aku ka kiʻekiʻe o ka hoʻohui ʻana o ke kaapuni i hoʻohui ʻia, ʻoi aku ka kiʻekiʻe o nā koi no ka photoresist. Hoʻokaʻawale ʻia nā kiʻi kiʻi Semiconductor i g-laina, i-line photoresists, KrF, ArF photoresists a me EUV photoresists, i waena o ke kaʻina hana o ArF photoresist he 7nm - 130nm.

Loaʻa i kā mākou kikowaena R&D ka hiki ke hoʻomohala i nā monomers hana, nā resins hana, nā photosensitizers a me nā mea photoresist ʻē aʻe, a hiki ke hoʻokō i ke kūʻokoʻa piha mai nā photoresist raw material i nā huahana photoresist a me nā mea kākoʻo. I kēia manawa, ke holomua nei ka hōʻoia ʻana o nā photoresists kiʻekiʻe e like me ke kaʻina hana maloʻo ArF, KrF manoanoa kiʻiʻoniʻoni, a me ka laina I-line, ua hōʻoia ʻia ʻekolu ArF photoresists, e hōʻoiaʻiʻo ana e hiki iā mākou ke hāʻawi i nā hoʻonā e hoʻokō i nā mea hou loa i ke kahua semiconductor.

noi:

ʻO nā mea kiʻi paʻi kiʻi ArF he mau mea koʻikoʻi koʻikoʻi i ke kahua o ka hana kaʻapuni integrated a hiki ke hoʻohana ʻia i nā kaʻina hana hana kaʻapuni i hoʻohui ʻia ma 90nm ~ 14nm a me nā nodes ʻenehana 7nm. Hoʻohana nui ʻia lākou i ka hana kaapuni i hoʻohui ʻia, 3D-IC advanced packaging, IC kuʻuna ʻōpala a me ka hoʻāʻo ʻana, a me nā māla ʻē aʻe. Hoʻohana nui ʻia lākou i ka hana ʻana i ka chip kiʻekiʻe, me nā chips logic, AI chips, 5G chips, nui-capacity memory chips, a me cloud computing chips.

Nā lawelawe hiki ke hāʻawi ʻia:

ka nānā ʻana i nā hiʻohiʻona noiʻi mea kūʻai aku, nā mea pili, ka hoʻoponopono pilikia ʻenehana.

Pūnaewele

Loaʻa iā Semixlab 2 laboratories, kahi hui o nā loea me 20 mau makahiki o ka ʻike waiwai, me ka R&D a me ka hana, hoʻāʻo a hōʻoia.

Hoʻoponopono Kūmole:

1. noi nui：Hoʻohana nui ʻia ia i nā kula e like me ka hana kaapuni i hoʻohui ʻia, 3D-IC kiʻi kiʻekiʻe kiʻekiʻe, a me ka IC kuʻuna a me ka hoʻāʻo ʻana. A me ka hana ʻana i nā chip kiʻekiʻe, me nā chips logic, AI chips, 5G chips, nui-capacity memory and cloud computing chips, etc.

2. Nā ʻāpana kikoʻī kumu:

ʻO ka substrate Si (HMDS), ka mānoanoa kiʻiʻoniʻoni 1.25μm, pre-bake 100 ℃ 60sec, hōʻike 120 ℃ 90sec, hoʻonā 7nm ~ 90nm, ola papa i ka hapalua makahiki, mālama ʻia ma ka wela haʻahaʻa, ʻaʻole i oi aku ma mua o 20 ℃.

ʻO ka hana huahana

Nā kahua noi nui

ʻO ka hōʻoia ʻana i ke kaulahao kaiaola

Ua hōʻoia ʻia ʻo 193nm ArF photoresist e ʻelua mau mea hana chip, ka waiho ʻana a me ka loiloi, lilo ʻo ia ka huahana photoresist ArF mua i hala i ka hōʻoia ma Kina.

Kaʻina hana maʻamau

Ka hoʻomākaukau ʻana i nā mea maka → Hoʻomaʻemaʻe Wafer → Hoʻomaʻemaʻe i ka papa photoresist (holoi hoʻomaʻemaʻe a hoʻomaʻemaʻe plasma paha) → Pretreatment (hoʻomaʻemaʻe ʻana i ka waikawa a me ka hoʻoulu ʻana i ka ʻili) → Ka mālama ʻana i ka mānoanoa o ka papa photoresist → Ka uhi ʻana a me ka hoʻokumu ʻana i ke kiʻiʻoniʻoni → Hōʻike a me ka hoʻomohala ʻana → Etching protection → Ke hana hou ʻana (stripping, hoʻomaʻemaʻe a me ka annealing)

Ma o ke kaʻina hana hoʻohālikelike, ua hoʻokō ʻo Semixlab photoresist i ka holomua holomua ma ke kahua o ka photoresist kiʻekiʻe kiʻekiʻe o ka home, hoʻololi mālie i nā mea lawe mai i ka mākeke photoresist semiconductor, a ua hoʻohana maikaʻi ʻia i ka hana ʻana a me ka hana ʻana o LCD, OLED a me nā paneli hōʻike ʻē aʻe. Inā pono ʻoe e kiʻi i nā pepa keʻokeʻo ʻenehana kikoʻī a i ʻole e hoʻonohonoho i ka hoʻāʻo ʻana, e ʻoluʻolu e kelepona i kā mākou hui kākoʻo ʻenehana.

ʻO nā pono Semixlab Photoresist Core

Nā pono hana huahana

ʻO ka hoʻonā kiʻekiʻe: e hoʻomaʻemaʻe i ke ʻano kaapuni ma ka chip, e hoʻomaikaʻi i ka hoʻohui ʻana a me ka hana o ka chip.

ʻO ka ʻokoʻa kiʻekiʻe a me ka transmittance kiʻekiʻe: kōkua i ka hoʻokō maikaʻi ʻana i ka hoʻololi ʻana i ke ʻano i ka wā o ka lithography, hoʻomaikaʻi i ka pololei a me ka pono o ka lithography, a pēlā e hoʻomaikaʻi ai i ka hua a me ka hilinaʻi o ka chip.

Nā pono noiʻi ʻenehana a me ka hoʻomohala ʻana

Loaʻa i ke kūʻokoʻa piha mai nā mea waiwai photoresist i nā huahana photoresist a me nā mea kākoʻo.

Ua hōʻoia ʻia ʻo ArF photoresist no nā pahu hoʻomanaʻo hoʻomanaʻo o nā mea kūʻai aku 50nm a me nā huahana node ʻenehana 55nm.

Hoʻonui ka mana a me ka hana nui

E hōʻea mākou i ka pālākiō hana makahiki o 25 tons o 193nm (ArF dry and immersion) photoresist huahana, e hoʻohana ʻia no ka hoʻomohala ʻana i ka hana ʻana o nā photoresist a me nā mea kākoʻo e hoʻokō i nā pono o ka ʻoihana kaapuni i hoʻohui ʻia.