apo lihi SiC paa

Nā hiʻohiʻona hana nui

Hana ʻia ʻo Semixlab Bulk SiC Edge Ring e hoʻokō i nā koi koʻikoʻi o ka hana semiconductor e hiki mai ana. ʻO nā hiʻohiʻona hana aʻe e lilo ia i koho koho no nā keʻena etch plasma i nā mea hana kiʻekiʻe:

● Kūʻē Kūʻē Plasma Bombardment

Hana ʻia mai ka carbide silika paʻa maʻemaʻe kiʻekiʻe, hōʻike ke apo i ke kūpaʻa kūʻokoʻa i ka plasma kiʻekiʻe kiʻekiʻe, e hōʻoiaʻiʻo ana i ka liʻiliʻi o ka lole a me ka lōʻihi o ke ola ʻana ma lalo o ka pōʻino ion.

● ʻOi aku ka maikaʻi o ke kinoea kino

Hāʻawi nā mea SiC i ka inertness kemika kiʻekiʻe, me ka pale ʻana i nā kinoea etch corrosive e like me Cl₂, CF₄, a me SF₆ me ka ʻole o ka hoʻohaʻahaʻa ʻana i ka ʻili, ʻoiai ma nā wahi wela kiʻekiʻe.

● Kū'ē Kū'ē Thermal a me ke kū'ēʻana i ka Thermal Strain

Me ka thermal conductivity o 120-150 W/m·K a me ka haʻahaʻa thermal expansion coefficient (~ 4.5 × 10⁻⁶ / K), ʻo ka SiC paʻa paʻa e mālama i ke kūpaʻa dimensional a me ka pono mechanical i ka wā o ka holo wikiwiki.

● Ili Maheʻe, Hana ʻAʻohe Particle

ʻO nā ʻenehana hoʻopau ʻili kiʻekiʻe e hōʻoia i ka haʻahaʻa haʻahaʻa o ka ʻili (Ra ≤ 0.2 µm), e hōʻemi ana i ka hoʻokumu ʻana o nā ʻāpana a me ka hoʻomaʻemaʻe ʻana i nā kaʻina hoʻomaʻemaʻe keʻena, e hōʻemi ana i ka downtime.

● ʻAʻohe Warping a i ʻole Deformation i ka manawa

ʻAʻole like me nā apo lihi composite maʻamau, ʻo kā mākou monolithic SiC hoʻolālā e noho paʻa a paʻa i loko o nā kaʻina hana lōʻihi, e hāʻawi ana i ka hana hilinaʻi ma luna o nā ola lōʻihi.

No ke aha e koho ai i nā Rings Semixlab SiC Edge?

Ma Semixlab, hāʻawi mākou i ka maikaʻi kiʻekiʻe i kākoʻo ʻia e ka loea a me ka hana hou. Eia ke kumu i kū ai ʻo Semixlab SiC Edge Rings:

● Hoʻoponopono Kūʻai Kūʻai

Hāʻawi mākou i ka hana maʻamau e pili ana i kāu kikoʻī kaʻina hana, me nā anawaena o loko/waho, mānoanoa, a me nā uhi ʻili kūikawā a i ʻole nā ​​​​mea leʻaleʻa, e hōʻoia ana i ke kūpono kūpono a me ka hana maikaʻi loa i kāu keʻena etch.

● Nui o nā ʻano

Kākoʻo ʻo Semixlab i nā papa hana etch like ʻole me TEL, Lam, AMAT, a me nā ʻōnaehana OEM maʻamau, me nā apo maʻamau a me nā mea hana pono e kūpono i nā pono kaʻina hana like ʻole.

● Kūleʻa Paʻa, Hoʻouna wikiwiki

Me ka hana ʻana i hōʻoia ʻia e ISO, ka mana koʻikoʻi o ka maikaʻi, a me ke kaulahao hoʻolako streamlined, hōʻoia mākou i ka hana mau ʻana, nā manawa alakaʻi pōkole, a me ka lawe ʻana i ka manawa e hoʻomau i ka neʻe ʻana o kāu hana me ke kali ʻole.

Nā waiwai kino kumu o Solid SiC

Hoʻohana i ka Semiconductor Manufacturing

He mea koʻikoʻi ka Solid SiC Edge Ring i ke kaʻina hana etching plasma wafer silicon, kahi e lawelawe ai ma ke ʻano he pale a hoʻolālā i waena o ka wafer a me ka lako keʻena. Hoʻonoho ʻia a puni ka lihi o ka wafer, ʻo kēia ʻāpana e hōʻoia i ka paʻa o ke kaʻina hana, pale i ka electrostatic chuck (ESC), a hōʻemi i ka hopena o ka hoʻohaumia ʻana ma o ka pale ʻana i ka hōʻiliʻili ʻana. He mea waiwai nui ia i ka etching maloʻo kiʻekiʻe a me ka RIE (Reactive Ion Etching) kaiapuni kahi e koʻikoʻi ai ka hana hou ʻana, ka pale lumi, a me ka hilinaʻi lōʻihi.