CMP poni abrasive

ʻO ka CMP (Chemical Mechanical Planarization) polishing abrasive he mea nui i ka hana o ka semiconductor manufacturing, optical glass, integrated circuits, etc., a hoʻokō i ka nano-level surface flattening ma o ka hopena synergistic o ka chemical corrosion a me ka mechanical grinding.

noi:

ʻO ka CMP polishing abrasives he mau mea koʻikoʻi koʻikoʻi ma ke kahua o ka hana kaapuni i hoʻohui ʻia a hiki ke hoʻohana ʻia i ka integrated circuit ILD, semiconductor monocrystalline silicon wafers, semiconductor silicon carbide, integrated circuit shallow trench isolation (STI), integrated circuit polysilicon (Poly - Si), integrated circuit metala a me nā papa pale metala.

Nā lawelawe hiki ke hāʻawi ʻia:

ka nānā ʻana i nā hiʻohiʻona noiʻi mea kūʻai aku, nā mea pili, ka hoʻoponopono pilikia ʻenehana.

Pūnaewele

Loaʻa iā Semixlab 2 laboratories, kahi hui o nā loea me 20 mau makahiki o ka ʻike waiwai, me ka R&D a me ka hana, hoʻāʻo a hōʻoia.

Nā hōʻailona hana no nā huahana maʻemaʻe ultra-kiʻekiʻe

Nā kahua noi nui

ʻO ka hōʻoia ʻana i ke kaulahao kaiaola

ʻO Semixlab CMP polishing abrasives e hālāwai me ka hōʻoia o ka ʻoihana semiconductor a ua hala i ka palapala ISO 14001/45001/9001.

Kaʻina hana maʻamau

Mea maka → Abrasive Synthesis (Surface modification)→ Slurry Formulation (Filtration/PH adjustment)→ CMP polishing (EPD control)→ Post-Clean → Inspection (AFM/KLA)→ Data Feedback Optimization

Ma o ke kaʻina hana hoʻohālikelike, ua hoʻokō ʻo Semixlab CMP polishing abrasive i ka holomua holomua ma ke kula o ka home high-end semiconductor integrated circuit, hoʻololi mālie i nā mea lawe mai i ka mākeke semiconductor, a ua hoʻohana maikaʻi ʻia i ka hana a me ka hana ʻana o LCD, OLED a me nā paneli hōʻike ʻē aʻe. Inā pono ʻoe e kiʻi i nā pepa keʻokeʻo ʻenehana kikoʻī a i ʻole e hoʻonohonoho i ka hoʻāʻo ʻana, e ʻoluʻolu e kelepona i kā mākou hui kākoʻo ʻenehana.

ʻO Semixlab CMP polihing abrasive kumu pono

a.Freely adjustable particle anawaena a me ka degere o ka particle aggregation;

b.Monodisperse nā ʻāpana me ka hāʻawi like ʻana i ka nui o ka nui;

c.Stable dispersion system;

d.Ka hiki ke hana nui me ka liʻiliʻi liʻiliʻi o ka hoʻololi ʻana i ka batch-to-batch;

e.Highly paʻa, kū'ē i ka agglomeration a me ka sedimentation.

Nā hale kūʻai abrasive Semixlab CMP polishing